GPS Module GPS Engine Board GPS模块
Features
HardwareSoftware
-Based on the high performance features of the SiRF Star III low power single chipset.
-Dimensions: 40.64 x 71.12 x 1.4 mm (1.6 x 2.8 x 0.5 inch)
-RoHS compliant (lead-free)
Performance
-Cold/Warm/Hot Start Time: 42 / 38 / 1 sec. at open skystationary.
-Reacquisition Time: 0.1 second
Interface
-DIP type pitch 2.0mm- 2x10 pin header.
-Protocol: NMEA-0183 compliant.
-Baud Rate: 4800 bps.
-Right angle MCX (RMCX) RF Connector.
GPS Module SiRF TechnicalSpecifications
Feature Item Description
Chipset GSC3f/LP Series SiRFstarIII/LP single chip technology
General Frequency L1, 1575.42 MHz
C/A code 1.023 MHz chip rate
Channels 20
Accuracy Position 10 meters, 2D RMS
5 meters 2D RMS, WAAS corrected
< 5meters(50%), DGPS corrected
Velocity 0.1 meters/second
Time 1 microsecond synchronized to GPS time
Datum Default WGS-84
Time to First Fix(TTFF)
(Open Sky &
Stationary Requirements) Reacquisition 0.1 sec., average
Hot start 1 sec., average typical TTFF
Warm start 35 sec., average typical TTFF
Cold start 42 sec., average typical TTFF
Dynamic
Conditions Altitude 18,000 meters (60,000 feet) max.
Velocity 515 meters/second (1000 knots) max.
Acceleration 4g, max.
Power Main power input 3.3 ~ 5.0 VDC
Power consumption ≈250 mW (continuous mode)
Supply Current ≈50mA 5.0 VDC
Backup Power 2.0 ~ 5.0 VDC input.
Interface Pin Header DIP type pitch 2.0mm 2x10 pin header
Protocol messages NMEA-0183 4800 bps